It is best to provide data in Gerber 274-X format. In addition, Cam350, CAD, Protel 99se, PADS, DXP and Eagle can also be processed.

Orders of fast sample boards, bulk and multi-layer samples with price advantage, as well as and special panel veneers

Production of rigid boards, soft boards, rigid-flex boards and stencils as well as SMT processing and assembly

Currently, for the normal products, such as the sample boards less than a square meter, the delivery cycle is such that, 5 days for 2-layer boards, 6 days for 4-layer boards, 7 days for 6-layer boards, 8 days for 8-layer boards, 10 days for 10-layer boards, 10 days for 12-layer boards. If the delivery cycle still fails to meet your current demand, we can arrange for expedited services for your products to finish 2 to 4 days in advance on the basis of the present delivery cycle. I think such a delivery time will definitely be able to meet the delivery requirements for your current products.

The expedited fee is to be determined depending on the processing difficulty of the boards and the actual situation of the production line, and it is necessary to provide data for specific offer.

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

The orders of PCBA manufacturing sample boards in our company refer to the orders with the specified batch number less than 100PCS. The welding mode for such orders is the same way as that of large-batch orders, and the whole-process machine welding mode is adopted. The advantages of adopting the machine welding mode are that, the consistency of product quality is good; the uncertainty factors of products caused by manual welding are resolved, thus to affect the judgment in product development stage; the mode of analog product batch manufacturing improves the adaptability of products imported into batch manufacturing, etc.

Currently, for the manufacturing of sample boards, small batch and batch orders, the high-precision placement can be easily completed by adopting the conventional process. For example: The smallest placement size of CHIP elements is 0201; and the center-to-center distance of the adjacent solder points of BGA elements can achieve 0.4mm.